As an important conference leading the world in electronic packaging technology, ICEPT2022 was held in Dalian on August 9-11, 2022. The conference report covers the cutting-edge research, technology and application solutions of advanced packaging, covering the hottest closed test issues at present, attracting more than 500 professionals from the government, domestic and foreign universities, research institutions, electronic packaging manufacturers, including more than 4500 online viewers to watch and share. To become a professional platform to promote the industry towards technological innovation, academic exchange and international cooperation.

Zhang Tianyu, a master student in the research group, gave an oral report on" Thermal expansion coefficient of Cu-Al₂O₃ nanocomposites by molecular dynamics simulation". The effects of mass fraction, distribution and morphology of doped particles on thermal expansion coefficient of Cu-Al₂O₃  nanocomposites were studied by molecular dynamics simulation method, which provided data support for Cu filling TSV materials and its application in electronic packaging. Wang Nanyu, a master student in the research group, gave an oral report of "Predicting the interfacial thermal resistance of electronic packaging materials via machine learning". A prediction model of heterogeneous interface thermal resistance based on machine learning algorithm was constructed to provide reference and guidance for the subsequent interface thermal design selection of electronic packaging materials.